TM100 6.0x1.5mm, 0.30mm thick, PL Metallized
ThermalPolycrystalline
TM100 6.0x1.5mm, 0.30mm, PL Met
The part is a TM100 (Tc>1000W/mK) 6 x 1.5 x 0.3 mm diamond with Ti/Pt/Au (100/120/500nm) metallization on the 6 x 1.5 mm sides.
Element Six's Thermal Management Grades of Polycrystalline CVD diamond (Diafilm™) are proven thermal management materials ideal for high-power RF, opto-electronics, and high-voltage power semiconductor devices. They reduce thermal gradients near a device, typically by 25 to 30%, allowing either higher power devices to be used without increasing the system size, or reducing operating temperature under the same conditions allowing for increased device lifetime.
Working with our coating partners, Element Six offer a variety of metallization schemes applied to Diafilm™ such as Ti/Pt/Au, W, Pt, Ti, and many more. Combined with our wide range of thermal grade materials, these metallizations allow tailor-made parts to meet your application needs.
For more information, please download our Diamond Handbook or Contact us
- Carat Weight EA: 0.05
- Lateral Dimensions Measured: to smaller side
- Edges: Laser cut , metallization not specified
- Edge Features: < 0.2 mm
- Laser Kerf: <5°
- Lateral Tolerance: +/- 0.05 mm
- Length: 6 mm
- Metallization Scheme: Ti/Pt/Au (100/120/500 nm)
- Packaging: Packed in chip trays ( 5 pcs / pack)
- Side 1, Roughness, Ra: metallized, Ra < 50 nm
- Side 2, Roughness, Ra: metallized, Ra < 250 nm
- Thickness Tolerance: +/- 0.03 mm
- Thickness Dimension: 0.3 mm
- Width: 1.5 mm
- Bulk Resistivity of diamond (Rv): 1x1012 Ohm cm
- Surface resistivity of diamond (Rs): 1x1010 Ohm cm
- Thermal conductivity of diamond: >1000 Wm-1 K-1 @293 K
- Thermal diffusivity of diamond: >5.5 @ 300 K (cm2s-1)
- Thermal Expansion Coefficient of diamond: 1.0 ± 0.1 @ 300 K (ppm K-1)